SX-SDMAC Plus

Smaller, Cheaper, and Higher Performance 802.11ac Wireless Module

The Silex SX-SDMAC is a dual-band IEEE802.11a/b/g/n/ac WLAN plus Bluetooth 4.2 SDIO module optimized for cost, size and performance. It is based on the QCA9377-3 chipset.

Silex IoT Connectivity Solutions Page

Top Features:

  • Smallest Form Factor in the SX-SDMAC Family
  • Lower Cost Design
  • Enhanced Tx Power Support
  • Dual Band SDIO Wi-Fi Module with 802.11ac WLAN
  • Link Rate upto 433 Mbps
  • Bluetooth 4.2 BR/EDR/LE Smart Ready
  • FCC/IC/CE/MIC Modular Certification

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How is it different from the orignal SX-SDMAC?

This new design is optimized for cost, size and performance that makes it a very compelling option for customers who want to take advantage of the higher 802.11ac performance at a lower cost and smaller overall footprint. 

It is optimized for both size and cost by redesigning the PCB, removing the RF switch and the additional antenna connector available on our other SX-SDMAC SKU’s. Also by using an Xtal crystal oscillator instead of TCXO, the SX-SDMAC-Plus offers higher Tx power which results in better Wi-Fi coverage and performance.

SX-SDMAC SKU's

Wireless Driver Options:

  • Linux (kernel 4.1)
  • Windows (WEC7, WEC2013, Win10/10IoT)
  • Android (Lollipop, Marshmallow, Nougat)

Features and Benefits:

  • Optimized for size, cost and performance
  • Based on the QCA9377-3 chipset
  • 802.11 a/b/g/n/ac Wave 2 MU-MIMO
  • Bluetooth 4.2 BR/EDR/LE Smart Ready
  • Enhanced Tx Power
  • SDIO 3.0 WLAN host interface
  • Link Rate upto 433 Mbps
  • Supports enterprise security, seamless roaming and CCX
  • Fine tuned calibration per module
  • FCC/IC/CE/MIC modular certification
  • Extended temperature range
  • Surface mount, and SDIO card form factor versions
  • Various driver options for Linux, Anndroid, Windows and open source ath10k

Silex IoT Connectivity Solutions Page

SX-SDMAC Plus Block Diagram

General Specifications

Items

Specifications

 Product Name

 SX-SDMAC-2832S+

 Chipset

 QCA9377-3

 Connector Type

 SMT : 44 pins direct solder pads

 Antenna Connectors

 1 u.FL 

 Antenna Configuration

  1x1 mode (1T1R)

 Device Interfaces

 SDIO v3.0 for Wi-Fi

 UART for Bluetooth

 RF Interface

 IEEE802.11a/b/g/n/ac

 Bluetooth 4.2 BR/EDR/LE Smart Ready

 Dimensions

 17.00 x 18.00 x 2.6 mm  

 Operating Temperature

 -20 to +85 °C Ambient

 MTBF

 90,000 hours

 Power Supply Voltage

 3.3V

 Modular Certifications

 FCC/IC, CE, MIC

Click on the contents file below to download the latest documentation for your product.

Unless otherwise noted, the documentation is in PDF format and requires Adobe Acrobat Reader to view.

Specifications:
Certifications:
  • FCC/IC Grants and Test Reports (NDA Required)
  • CE Test Reports (NDA Required)
  • MIC Grant and Test Reports (NDA Required)             
Application Notes:

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